Pixel Bump Bonding Status

OCTOBER, 2003

Two types of bump-bonding technology are under investigation: indium and flux-less solder. Indium has been used so far on the prototype devices. We have started bench tests of solder bumped hybrids. We will use both types in the beam tests. Both technologies appear to have acceptable yield and robustness. Large-scale thermal-cycle tests have been performed on both indium and fluxless-solder bump-bonded devices. We have also studied the effects of irradiation and gluing to Thermal Pyrolytic Graphite (TPG) support material. Only small changes were observed. The preliminary conclusion is that while both indium and fluxless solder are viable techniques, solder bumps appear more robust so far.

APRIL, 2002

Two types of bump-bonding technology are under investigation: indium and flux-less solder. Indium has been used so far on the prototype devices. Tests on fluxless solder have been done on dummy silicon test pieces. Both technologies appear to have acceptable yield and robustness. The final technology choice can be made later.

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