Pixel HDI and Cable Status

MARCH, 2003

Prototype HDIs have been received from CERN. Chip control and data output have been exercised through these devices with little effect on noise or other bench-test operation. A first five-chip detector module has been successfully tested with a radioactive source. Work is progressing to include this device in the test beam. Work has also started on the layout of the new HDI for the FPIX2-based modules. Potential vendors for production HDI orders have been contacted. The connection from the HDI to the outside of the pixel detector system will have separate signal and power cables to better optimize the conductor to insulator ratios. Lifetime testing of a prototype HDI flexible cable suggests that the BTeV design is adequate far beyond the number of flexing cycles anticipated for the detector.

APRIL, 2002

Prototype HDIs have been ordered from CERN. Chip control and data output have been exercised through these devices with little effect on noise or other bench-test operation. Vendors for production orders must be found, and the design optimized for yield. The connection from the HDI to the outside of the pixel detector system will have separate signal and power cables to better optimize the conductor to insulator ratios. Lifetime testing of a prototype HDI flexible cable suggests that the BTeV design is adequate far beyond the number of flexing cycles anticipated for the detector.

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